Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperatures

Microelectronic packaging plays an important role in cryogenic engineering; in particular, a solder joint as interconnection, which offers a mechanical, thermal and electrical support, undergoes much larger and harsher thermal changes during its service compared with conventional customer electronic...

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Bibliographic Details

Main Authors:	X. Cheng, Changqing Liu, Vadim Silberschmidt
Format:	Default Article
Published:	2012
Subjects:	Mechanical engineering not elsewhere classified Condensed matter physics not elsewhere classified Indium joint Creep Cryogenic temperature Finite elements Mechanical Engineering not elsewhere classified Condensed Matter Physics
Online Access:	https://hdl.handle.net/2134/13130
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