Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects

The operating temperature of high-temperature electronics can significantly promote the growth of intermetallic compounds (IMCs) at solder/substrate interfaces, particularly for low-cost Zn-based solders because of the rapid rate of reaction of Zn with Cu. Thus, a reliable and robust diffusion barri...

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Bibliographic Details

Main Authors:	Li Liu, Zhiwen Chen, Zhaoxia Zhou, Guang Chen, Fengshun Wu, Changqing Liu
Format:	Default Article
Published:	2017
Subjects:	Mechanical engineering not elsewhere classified Condensed matter physics not elsewhere classified Zn-5Al solder Electroless Ni-W-P coating Diffusion barrier Interfacial reaction Kirkendall voids Mechanical Engineering not elsewhere classified Condensed Matter Physics
Online Access:	https://hdl.handle.net/2134/25511
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