Finite element analysis of lead-free surface mount devices

Transition to lead-free solder materials has raised concerns over the reliability of lead-free solder joints in the electronic industry. Solder joints provide electrical conduction and mechanical support for components and may operate over temperature extremes of -55oC to 125oC or greater. These tem...

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Bibliographic Details

Main Authors:	Pradeep Hegde, Andrew R. Ochana, David Whalley, Vadim Silberschmidt
Format:	Default Article
Published:	2008
Subjects:	Mechanical engineering not elsewhere classified Condensed matter physics not elsewhere classified Solder joint Lead-free Thermo-mechanical fatigue Mechanical Engineering not elsewhere classified Condensed Matter Physics
Online Access:	https://hdl.handle.net/2134/3750
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