Diffusivity variation in electromigration failure

Electromigration driven void dynamics plays an important role in the reliability of copper interconnects; a proper understanding of which is made more difficult due to local variations in line microstructure. In simulations, the parameter incorporating these variations best is the effective atomic d...

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Bibliographic Details

Main Author:	Vincent Dwyer
Format:	Default Article
Published:	2012
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/10939
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