Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: physical properties, solderability and microstructural evolution under isothermal ageing

This paper is focused on the effect of TiC nano-reinforcement that was successfully introduced into a SAC305 lead-free solder alloy with different weight fractions (0, 0.05, 0.1 and 0.2 wt%) through a powder-metallurgy route. Actual retained ratios of TiC reinforcement in composite solder billets an...

Full description

Bibliographic Details

Main Authors:	Guang Chen, Hao Peng, Vadim Silberschmidt, Y.C. Chan, Changqing Liu, Fengshun Wu
Format:	Default Article
Published:	2016
Subjects:	Mechanical engineering not elsewhere classified Condensed matter physics not elsewhere classified TiC nanoparticles Lead-free solder Wettability Interfacial IMC Mechanical properties Isothermal ageing Mechanical Engineering not elsewhere classified Condensed Matter Physics
Online Access:	https://hdl.handle.net/2134/21917
Tags:	Add Tag No Tags, Be the first to tag this record!