Influence of viscoelastic properties of encapsulation materials on the thermomechanical behavior of photovoltaic modules

In this work, the mechanical properties of encapsulation materials for photovoltaic modules have been studied. A finite element model has been developed to simulate the degradation of solder bonds within modules subjected to different environmental conditions. Various polymeric encapsulants are char...

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Bibliographic Details

Main Authors:	Michael Owen-Bellini, Daniel Montiel-Chicharro, Jiang Zhu, Tom Betts, Ralph Gottschalg
Format:	Default Article
Published:	2017
Subjects:	Mechanical engineering not elsewhere classified Foundations of quantum mechanics Durability Encapsulation Finite element Polymer characterization Photovoltaic (PV) modules Solder bond fatigue Viscoelasticity Mechanical Engineering not elsewhere classified Quantum Mechanics
Online Access:	https://hdl.handle.net/2134/27476
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