Excimer laser machining of microvias in glass substrates for the manufacture of high density interconnects

Machining of microvias in 100-50 μm thick CMZ glass using an excimer laser (248 nm) was investigated. The effect of various laser process parameters: pulse energy, repetition rate, irradiation time were studied to optimise the microvia drilling process and a process window was identified. Through-ho...

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Bibliographic Details

Main Authors:	Deepa Bhatt, David Hutt, Paul Conway
Format:	Default Article
Published:	2012
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified Mechanical Engineering
Online Access:	https://hdl.handle.net/2134/13359
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