Epoxy adhesive behaviour on ceramic surfaces in commercial optoelectronic assemblies

Chemical and physical variability in the as-received state of aluminium oxide and aluminium nitride ceramic substrate materials used in optoelectronic modules currently leads to a process yield less than 100% when adhesives are used for assembly and interconnection. The phenomenon of epoxy bleed is...

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Bibliographic Details

Main Authors:	Owain Williams, Changqing Liu, Patrick Webb, P. Firth
Format:	Default Article
Published:	2010
Subjects:	Mechanical engineering not elsewhere classified Epoxy/epoxides Ceramics Epoxy bleed Mechanical Engineering not elsewhere classified Mechanical Engineering
Online Access:	https://hdl.handle.net/2134/7942
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