Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal condition

This study focuses on the mechanism of phase transformation from Cu6Sn5 into Cu3Sn and the homogenization process in full intermetallics (IMCs) micro-joints, which were prepared by soldering the initial Cu/Sn/Cu structure through high temperature storage in vacuum environment as the Transient Liquid...

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Bibliographic Details
Main Authors: Liping Mo, Zhichao Chen, Fengshun Wu, Changqing Liu
Format: Default Article
Published: 2015
Subjects:
Mechanical engineering not elsewhere classified
Intermetallics
Phase transformation
Grain boundary diffusion
Electron backscatter diffraction
Nanoindentation
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/18563
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