Materials and processes issues in fine pitch eutectic solder flip chip interconnection

New product designs within the electronics packaging industry continue to demand interconnects at shrinking geometry, both at the integrated circuit and supporting circuit board substrate level, thereby creating numerous manufacturing challenges. Flip chip on board (FCOB) applications are currently...

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Bibliographic Details

Main Authors:	Changqing Liu, M.W. Hendriksen, David Hutt, Paul Conway, David Whalley
Format:	Default Article
Published:	2006
Subjects:	Mechanical engineering not elsewhere classified Flip-chip Shear Strength Stencil Printing Under Bump Metalization Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/3789
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