Formation of Ag3Sn plates in SnAgCu solder bumps

Special experiments are designed to obtain the solid reactants directly from a liquid solder during phase transformation. Series of such tests performed throughout reflow, which enables to investigate the entire formation process of intermetallic Ag3Sn plates out of liquid SnAgCu solder bumps. The r...

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Bibliographic Details

Main Authors:	Jicheng Gong, Changqing Liu, Paul Conway, Vadim Silberschmidt
Format:	Default Article
Published:	2010
Subjects:	Mechanical engineering not elsewhere classified Solder Solidification Crystal growth Intermetallics Mechanical Engineering not elsewhere classified Mechanical Engineering
Online Access:	https://hdl.handle.net/2134/13466
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