Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageing

The interlayers at solder/pad interface are critical to the reliability of solder joints; hence, their mechanical properties is of vital importance. However, the correlation between service duration and evolution of mechanical characteristics of these interlayers has seldom been reported. In this wo...

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Bibliographic Details

Main Authors:	Zhiwen Chen, Changqing Liu, Bing An, Yiping Wu, Li Liu
Format:	Default Article
Published:	2017
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/36625
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