Perpendicular growth characteristics of Cu-Sn intermetallic compounds at the surface of Sn99Cu1/Cu solder interconnects

The growth of intermetallic compounds (IMCs) on the free surface of 99Sn-1Cu solder joints perpendicular to the interdiffusion direction has been investigated in this work. The specimens were specifically designed and polished to reveal a flat free surface at the solder/Cu interface for investigatio...

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Bibliographic Details

Main Authors:	Zhiwen Chen, Changqing Liu, Yiping Wu, Bing An
Format:	Default Article
Published:	2015
Subjects:	Mechanical engineering not elsewhere classified Solder joint Planar growth of IMCs Perpendicular growth of 31 IMCs Interdiffusion Growth rate Formation sequence of IMCs Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/19455
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