APA (7th ed.) Citation

Chen, Z., Liu, C., Wu, Y., & An, B. (2015). Perpendicular growth characteristics of Cu-Sn intermetallic compounds at the surface of Sn99Cu1/Cu solder interconnects.

Chicago Style (17th ed.) Citation

Chen, Zhiwen, Changqing Liu, Yiping Wu, and Bing An. Perpendicular Growth Characteristics of Cu-Sn Intermetallic Compounds at the Surface of Sn99Cu1/Cu Solder Interconnects. 2015.

MLA (9th ed.) Citation

Chen, Zhiwen, et al. Perpendicular Growth Characteristics of Cu-Sn Intermetallic Compounds at the Surface of Sn99Cu1/Cu Solder Interconnects. 2015.

Warning: These citations may not always be 100% accurate.