The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applications

This report describe research into the role that surface topography plays in influencing the mechanical bond strength of the electroless copper plating of novel glass substrates. The work considers bespoke laser machining of glass substrates, electroless plating chemistry, areal surface topography a...

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Bibliographic Details

Main Authors:	Baofeng He, Jon Petzing, Paul Conway, D. Patrick Webb, Richard K. Leach
Format:	Default Report
Published:	2012
Subjects:	Mechanical engineering not elsewhere classified Surface Texture Glass Adhesion Copper ISO 25178 Plating Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/11558
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