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Performance of wire-bonded interconnects under combined thermal and vibration loads
Wire bonding is the process of providing electrical interconnections between an integrated circuit and the rest of the electronic package. Although wire bonding has been extensively utilised for chip-level interconnections, there is a lack of fundamental knowledge related to the reliability performa...
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| Format: | Default Thesis |
| Published: |
2015
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/17995 |
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