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Degradation study of the peel strength of mini-modules under damp heat condition
This paper presents the degradation study results of adhesion strength between backsheet and encapsulant for a commercial minimodule. A degradation model for the adhesion strength is developed and the activation energy is obtained. Outdoor prediction example is given based on environmental data in L...
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| Main Authors: | , , , |
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| Format: | Default Poster |
| Published: |
2013
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/14187 |
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