Atomic layer deposition (ALD) to mitigate tin whisker growth and corrosion issues on printed circuit board assemblies

This paper presents the results of a research program set up to evaluate atomic layer deposition (ALD) conformal coatings as a method of mitigating the growth of tin whiskers from printed circuit board assemblies. The effect of ALD coating process variables on the ability of the coating to mitigate...

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Bibliographic Details
Main Authors: Terho Kutilainen, Marko Pudas, Mark Ashworth, Tero Lehto, Liang Wu, Geoffrey Wilcox, Jing Wang, Paul Collander, Jussi Hokka
Format: Default Article
Published: 2019
Subjects:
Tin whiskers
Corrosion
Atomic layer deposition
ALD
Online Access:https://hdl.handle.net/2134/9751922.v1
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